Hot Chips 2020 Live Blog: AMD Ryzen 4000 APU (Noon PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
15 by Dr. Ian Cutress on 8/17/2020
Hot Chips 2020 Live Blog: IBM z15, a 5.2 GHz Mainframe CPU (11:00am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
21 by Dr. Ian Cutress on 8/17/2020
Hot Chips 2020 Live Blog: Marvell ThunderX3 (10:30am PT)
Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...
6 by Dr. Ian Cutress on 8/17/2020
Intel Brand Tie-ins: New Avengers Packaging Gives You a New Box To Play With
When buying a new processor, what’s the first thing to look for? Price? Performance? Frames per Second? The Box? Intel’s new brand tie-in with Marvel’s Avengers now seems official...
64 by Dr. Ian Cutress on 8/14/2020_carousel.jpg)
Intel Next-Gen 10-micron Stacking: Going 3D Beyond Foveros
One of the issues facing next-generation 3D stacking of chips is how to increase the density of the die-to-die interface. More connections means better data throughput, reducing latency and...
32 by Dr. Ian Cutress on 8/14/2020
Intel Alder Lake: Confirmed x86 Hybrid with Golden Cove and Gracemont for 2021
Following leaks is often a game of cat and mouse – what is actually legitimate and what might not be. Traditionally AnandTech shies away from leaks for that very...
89 by Dr. Ian Cutress on 8/14/2020
MMD and Phillips Launch the 279C9 27" Montior: FreeSync 4K IPS & USB Type-C
This week MMD and Phillips have unveiled its latest display in their ever-growing product range, the Phillips 279C9. A 27-inch monitor aimed squarely at content creators and professionals, the...
28 by Gavin Bonshor on 8/14/2020
Samsung Announces "X-Cube" 3D TSV SRAM-Logic Die Stacking Technology
Yesterday, Samsung Electronics had announced a new 3D IC packaging technology called eXtended-Cube, or “X-Cube”, allowing chip-stacking of SRAM dies on top of a base logic die through TSVs. Current...
21 by Andrei Frumusanu on 8/14/2020
Intel Xe-HPC GPU Status Update: 4 Process Nodes Make 1 Accelerator
Continuing today’s GPU news from Intel’s Architecture Day presentation, on top of the Xe-LP architecture briefing and Xe-HPG reveal, the company has also offered a brief roadmap update for...
20 by Ryan Smith on 8/13/2020
Intel’s Xe-HPG GPU Unveiled: Built for Enthusiast Gamers, Built at a Third-Party Fab
Among the many announcements in today’s Intel Architecture Day, Intel is also offering a major update to their GPU roadmap over the next 24 months. The Xe family, already...
39 by Ryan Smith on 8/13/2020
Intel Previews 4-Layer 3D XPoint Memory For Second-Generation Optane SSDs
As part of Intel's Architecture Day 2020 presentations, Raja Koduri spent a bit of time talking about the status of their Optane products. Most of it was a recapitulation...
27 by Billy Tallis on 8/13/2020
Microsoft Opens Pre-Orders for Surface Duo - US Only
Late last year in October, Microsoft had announced the Surface Duo, the company’s first ever Android device and first-party smartphone (if you can call it that) release in years...
71 by Andrei Frumusanu on 8/12/2020
Samsung Display Announces First VRR Mobile Display - Inside Note20 Ultra
By now we’ve become quite familiar with high refresh-rate displays in the mobile space, as the first pioneering 90Hz devices last year have now evolved into even faster refreshing...
31 by Andrei Frumusanu on 8/11/2020
US Appeals Court Reverses Antitrust Ruling in FTC vs Qualcomm
It’s been over three years since the United States FTC had charged Qualcomm with antitrust violations over cellular modem patents and business practices. That suit ultimately received a ruling...
23 by Andrei Frumusanu on 8/11/2020
Update: NVIDIA Teases GeForce Presentation For September 1st - Ampere Inbound?
Update 8/11: A day later, NVIDIA has published a bit more information, clarifying their product teasing and announcement plans. It looks like NVIDIA's Twitter feed jumped the gun a...
49 by Ryan Smith on 8/11/2020
NUVIA Phoenix Targets +40-50% ST Performance Over Zen 2 for Only 33% the Power
In November 2019, the company NUVIA broke out of stealth mode. Founded by former senior Apple and Google processor architects, John Bruno, Manu Gulati and Gerard Williams III, the...
50 by Dr. Ian Cutress on 8/11/2020
Intel Suffers Apparent Data Breach, 20GB of IP and Documents Leaked on to Internet
Intel today became the apparent victim of a massive internal data breach, as roughly 20 GB of various Intel documents and tools have begun showing up in a data...
82 by Ryan Smith on 8/6/2020
GIGABYTE Updates 4-GPU 2U G242 Server with Rome and PCIe4 for Ampere
As we wait for the big server juggernaut to support PCIe 4.0, a number of OEMs are busy creating AMD EPYC versions to fill that demand for high-speed connectivity...
14 by Dr. Ian Cutress on 8/6/2020
MediaTek Announces T700 5G Modem Powering Intel PCs Successfully Certified
Last year, Intel and MediaTek had announced a partnership with the goal of developing a 5G modem that would be used in future next-generation PC platforms. The move followed...
15 by Andrei Frumusanu on 8/6/2020
Intel Schedules Tiger Lake Architecture Presentation For August 13th, Launch on September 2nd
Over the next month or so Intel is scheduled to launch its next-generation Tiger Lake family of processors. Detailed in bits and pieces over the past several months, Tiger...
80 by Ryan Smith on 8/5/2020
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